Precision Diamond Wafering Blades, Dia: 76,2mm, Medium, each

These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements: High Concentration (H/C) for general laboratory use, either low or high saw’s speed. Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals.