CD-flat™, Holey Carbon (8.0 µm Hole Size, 2.0µm Spacing), Large Specimen, 300 Mesh, 50 pieces
ECDFT823-50
The new CD-flat™ are designed for Automated S/TEM Imaging and Metrology of large specimen, like 3D NAND FIB lamella. They are holey carbon (40nm thick) coated 300 Mesh cupper grids with a 8/2 pattern (8.0 µm diameter holes, 2.0µm spacing).
€550.00
€654.50
Product Details
Description
The C-flat™ Advantage
Made with patent pending technology, C-flat™ provides an ultra-flat surface that results in better particle dispersion and more uniform ice thickness. Patterning is done using deep-UV projection lithography, ensuring the most accurate and consistent hole shapes and sizes down to submicron features. The precise methods by which C-flat™ is manufactured elminate artifacts such as excess carbon and edges around holes.
More Information
| Hole Spacing |
2,0µm
|
|---|---|
| Coating |
Holey Carbon
|
| Grid Size | 3,05mm |
| Hole Shape |
round
|
| Hole Size | 8,0µm |
| Material |
Copper
|
| Material Symbol | Cu |
| Mesh Size |
300 Mesh
|
| Mesh Style |
square
|
| Packing Unit | 50 pieces |
| Manufacturer |
C-flat
|