+49 (089) 18 93 668 0 - Info@ScienceServices.de   Our lines are open: Mon - Thu 09:00-17:00, Fri 09:00-15:00
Language

Categories

eyes on

    • Starting at

      Price on request

      Starting at

      Price on request

      The FlipScribe is a manual scribing tool for backside scribing of substrates (e.g. wafer) and allows viewing of the substrate front side for accurate adjustment of the scribing position. It is a compact, stable and precise tool for fast scribing and cleaving and is suitable for a variety of materials: e.g. Si, sapphire, GaN, glass, SiC. The maximum substrate size is a 4 inch / 100mm wafer.

      • Starting at €961.64 €829.00

        Starting at €961.64 €829.00

        The Wafer Cleaving Kit XL contains all components of the Wafer Cleaving Kit Standard (E7642) and in addition the Lattice Scriber with a premium quality diamond tip and a pair of small sample cleaving pliers.

        • Starting at €453.79 €391.20

          Starting at €453.79 €391.20

          A complete set of tools for clean cleaving of wafers into strips and small pieces. With this set good cut cross-sections are achieved. The Wafer Cleaving Kit Standard consists of three diamond scribers, tweezers, a small and large (optional) cutting mat and a pair of pliers.

        Info, Media & Downloads

        Bestseller