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    • Starting at

      Starting at

      For small samples & up to 200mm wafers

      The FlexScribe Station is a fast and simple scribing workstation for dicing, downsizing, extracting and cross-sectioning of silicon wafers and other crystalline materials such as glass or sapphire. A carbide scribing wheel is mounted to a sliding scribing mechanism that guarantees straight scribes. It is suitable for various substrates from 5mm up to 200mm.

      • Starting at

        Price on request

        Starting at

        Price on request

        The FlipScribe is a manual scribing tool for backside scribing of substrates (e.g. wafer) and allows viewing of the substrate front side for accurate adjustment of the scribing position. It is a compact, stable and precise tool for fast scribing and cleaving and is suitable for a variety of materials: e.g. Si, sapphire, GaN, glass, SiC. The maximum substrate size is a 4 inch / 100mm wafer.

        • Starting at €391.20 €465.53

          Starting at €391.20 €465.53

          A complete set of tools for clean cleaving of wafers into strips and small pieces. With this set good cut cross-sections are achieved. The Wafer Cleaving Kit Standard consists of three diamond scribers, tweezers, a small and large (optional) cutting mat and a pair of pliers.

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