MicroSaw is a small, versatile diamond wheel saw, to be used under a standard stereo microscope. It is a dedicated cutting device for pre-trimming of TEM and smaller SEM specimens. It is a purpose-made tool for cutting almost any solid-state materials with 0.01mm accuracy. 

• Adjustable in 3 directions
• Can be used under stereo microscope
• Continuously variable rotation speed

For small samples & up to 200mm wafers

The FlexScribe Station is a fast and simple scribing workstation for dicing, downsizing, extracting and cross-sectioning of silicon wafers and other crystalline materials such as glass or sapphire. A carbide scribing wheel is mounted to a sliding scribing mechanism that guarantees straight scribes. It is suitable for various substrates from 5mm up to 200mm.

Specially selected glass strips for breaking glass knives with knife makers. The LKB glass hardness produces a durable and sharp edge suitable for thick, semi thin, or ultrathin sections. Available with 6.4 and 8mm thickness.

*** This glass is original from LKB stock. Very good glass quality, but the packaging is obviously old. ***

Blade for applications where extremely thin, high-quality sections are required. Suitable also for skin biopsy. Short trimming time and increased durability. With an angle of 30°.

Robust universal blade designed for daily routine, with excellent sharpness and durability. All-purpose, even for difficult tissue. Teflon coated, giving this blade an excellent durability. With an angle of 35°. Also suitable for cryostat cuttings.

Universal blade with plasma coating for daily routine, suitable for all types of tissue. Especially suitable for ribbon sectioning, excellent sharpness, even with very thin cuts. All-rounder with unique hardened blade cutting edge, excellent durability. With an angle of 35°.

The FlipScribe is a manual scribing tool for backside scribing of substrates (e.g. wafer) and allows viewing of the substrate front side for accurate adjustment of the scribing position. It is a compact, stable and precise tool for fast scribing and cleaving and is suitable for a variety of materials: e.g. Si, sapphire, GaN, glass, SiC. The maximum substrate size is a 4 inch / 100mm wafer.

High-precision, lightweight and versatile pin vise handle for diamond scribers and styli made of high quality gold-anodized aluminum. The hexagonal handle is 8mm wide and 100mm long (total length with clamp: 115mm). The serrated part of the handle supports a non-slip and safe handling of this precision tool.

With the standard collet chuck a selection of diamond scribing pins up to 2mm width can be clamped. A collet adapter allows clamping of thinner pins (up to 0.8mm).

A complete set of tools for clean cleaving of wafers into strips and small pieces. With this set good cut cross-sections are achieved. The Wafer Cleaving Kit Standard consists of three diamond scribers, tweezers, a small and large (optional) cutting mat and a pair of pliers.

The Wafer Cleaving Kit XL contains all components of the Wafer Cleaving Kit Standard (E7642) and in addition the Lattice Scriber with a premium quality diamond tip and a pair of small sample cleaving pliers.

For ultra thin sections. Using this Perfect Loop, you can place your thin sections, cut on the ultramicrotome, easily on the grid mesh without creases.

Section Pick-up with The Perfect Loop