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Wafer Cleaving Kit XL
The Wafer Cleaving Kit XL contains all components of the Wafer Cleaving Kit Standard (E7642) and in addition the Lattice Scriber with a premium quality diamond tip and a pair of small sample cleaving pliers.
Product Details
Description
The Wafer Cleaving Kit XL includes:
- Diamond Scriber: Pen style, optimal for top down scribe
- Diamond Scriber: Straight tip, optimal for top down precise marking and/or scribing
- Diamond Scriber: 30 degree tip, optimal for top down precise marking and/or scribing
- Tweezers with black soft fiber fine tip
- Lattice Scriber: special scriber with premium quality 8-point truncated diamond tip
- Small sample cleaving pliers
- CleanBreak Pliers: 6" wafer cleaving pliers; simple and clean way to cleave (post scribe) wafers to strips and smaller pieces; jaw opening: 1,9cm (¾")
- Small Ruler Mat: Self healing, double-sided, small wafer piece ruler mat, green/black, 3½" x 5½"
- Large Cutting Mat (optional): Self healing, double-sided, green/black, 45,7x 61cm (18" x 24")
- Tungston cleaving wire
- Ruler, Instructions
Note: Always remember to use safety goggles when cleaving a wafer.
More Information
| Packing Unit | kit |
|---|---|
| Suitable for | Wafer |
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