Designed for mounting large sections of neuro and breast tissue and manufactured from the highest quality white glass, with an innovative positive charge coating, Histobond® + Supa Mega slides (75,2 x 50,4 x 1mm) offer exceptional adhesive properties and provide a superior coverage of reagents across the slide.

A complete set of tools for clean cleaving of wafers into strips and small pieces. With this set good cut cross-sections are achieved. The Wafer Cleaving Kit Standard consists of three diamond scribers, tweezers, a small and large (optional) cutting mat and a pair of pliers.

The Wafer Cleaving Kit XL contains all components of the Wafer Cleaving Kit Standard (E7642) and in addition the Lattice Scriber with a premium quality diamond tip and a pair of small sample cleaving pliers.

The silicon wafer have a diameter of 100mm and have the following approximate properties:
Doping: boron (p type); Orientation: (100); Thickness: app. 525µm, Resistance: <20 Ohmcm. Depending on the batch thickness or resistance may vary slightly. The wafers are polished on one side. Wafer carrier/box included (no clean room quality).

The CleanBreak wafer pliers are a simple and clean way to cleave (post scribe) wafers, wafer strips and smaller pieces down to 3cm. They are 15cm long and have a jaw opening of 1,9 cm. The CleanBreak pliers come with two sets of replaceable jaws to cleave crystalline or amorphous materials.

To cleave smaller pieces than 30mm we recommend the Small Sample Cleaving Pliers.

A Fool-Proof method for the mounting of serial sections on Single Hole Grids.

These plexiglass slides are 3 x 1" (75 x 25 mm) and 1 mm thick. They prevent wrinkling and section loss while mounting sections on the grid.